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APECS: European pilot line for advanced heterogenous packaging
Advanced Packaging and Heterogeneous Integration of Electronic Components and Systems (APECS), establishes an European pilot line for advanced heterogeneous packaging.
€730 m
in funding
5
years
10
partners
Key numbers
About the project
The APECS pilot line, coordinated by Fraunhofer Group for Microelectronics / Research Fab Microelectronics Germany (FMD), aims to bolster the European Union's capabilities in the semiconductor sector, particularly in the development of next-generation technologies for advanced packaging and the integration of diverse chip and chiplet technologies.
Impact of the project:
The APECS pilot line is expected to have a transformative effect on the European semiconductor landscape by offering a European prototyping and piloting option for advanced packaging and heterogeneous integration, as well as access to European advanced packaging technologies and prototyping, fostering European semiconductor value chain, community and skills.
Funding instruments Chips JU, Horizon Europe and Digital Europe
Spinverse’s role
Spinverse funding experts supported Fraunhofer in their funding proposals by developing and optimising the content to ensure it matched the strict evaluation criteria set for the applicants. Spinverse was also supporting FMD in grant agreement negotiations.
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Spinverse had very good professional understanding of the project and knowledge of proposal formalities and procedures. Their combination of skills made them an invaluable partner for our APECS proposal, significantly contributing to our success.
Supporting the UN Sustainable Development Goals
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