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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing
The APPLAUSE project builds the competitive edge of component and systems development in Europe. New capabilities are developed and their match is demonstrated to the future needs of European industries.
€33.7 m
in funding
3
years
31
partners
11
countries
Key numbers
About the project
APPLAUSE is bringing advanced packaging and high-volume manufacturing concepts to optics and photonics via six industrial use cases. It is developing new simulation and test methods, processes and related process equipment, as well as process control equipment.
Impact of the project:
Increasing the competitiveness and global market share of European semiconductor industry. An increase in revenue for the project partners is estimated to be €300 million.
Funding instrument ECSEL JU / Chips JU
Spinverse’s role
During the proposal preparation phase, Spinverse assisted in all the steps from the project design and putting together a strong consortium, ensuring the high quality of the submitted project proposal.
Spinverse also provides daily administration support in running the funded project.
Supporting the UN Sustainable Development Goals
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